November 6-8, 2024
Shenzhen World Convention and Exhibition Center

2022 The 8th die-cutting/coating process seminar with you to discuss the development of die-cutting/coating industry

Conference Background

In recent years, on the one hand, with the Internet of Things technology, communication technology, artificial intelligence, cloud computing, big data and other technologies closely related to the consumer electronics industry continue to develop and popularize, 5G technology gradually enter the stage of large-scale popularization and application, the consumer electronics industry ushered in a new period of rapid development driven by technology, the market scale continues to expand.

On the other hand, consumer electronics products are being updated more and more quickly, people's demand for the product is also gradually improved, more pursuit of aesthetics, thin and light, so the demand for various components used in electronic products is also increasingly high, with the production process brought about by the requirements are also increasingly high.

2021 die-cutting and coating process seminar site at a glance

In order to help die-cutting / coating industry practitioners better understand more new technology, new technology, die-cutting / coating home, together with a number of industry production, technology, engineering and other experts, held the "2022 8th die-cutting / coating process seminar", now invite the majority of industry friends to take time to attend, and discuss the development of the industry.

Conference Information

Organizer: Home of Die-cutting, Home of Coating, Reed Exhibitions
Event Time: December 1, 2022, afternoon
Venue: Shenzhen World Exhibition & Convention Center (Baoan New Hall)
Conference scale: 300 people

Attendees: die-cutting/coating industry production, technology, engineering and other positions practitioners (free to attend)

Proposed agenda

  • New energy battery die-cutting solutions
  • RFID electronic label die-cutting solutions
  •  FPC die-cutting solutions
  • Die-cutting solutions for electromagnetic shielding materials and devices
  • Die-cutting solutions for thermally conductive materials and devices
  • Adhesive materials in the new energy field solutions
  • Adhesive/film material inspection solutions