TGV Glass Substrate Advanced Packaging Accelerates Toward Industrialization as AI, Chiplet, HBM and CPO Drive Next-Generation Packaging Demand

SHENZHEN, China — September 23, 2026 — As AI servers, high-performance computing, Chiplet, HBM and co-packaged optics (CPO) continue to advance, semiconductor packaging is facing rising requirements for package size, interconnect density and high-speed signal transmission. Against this backdrop, TGV (Through-Glass Via) glass substrates are moving from laboratory validation toward customer qualification and production readiness, supported by their high flatness, low dielectric loss, thermo-mechanical stability and potential for large-format processing.

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The industrialization race is accelerating. Intel has demonstrated a 78 mm × 77 mm glass-core substrate prototype integrating an EMIB bridge; Absolics is advancing package-level reliability testing and customer qualification; Samsung Electro-Mechanics, together with Dongwoo Fine-Chem, is investing approximately KRW 482.1 billion in a glass-core industrialization platform planned for operation in the second half of 2027; and Japanese companies including DNP are validating samples based on large 510 mm × 515 mm glass panels. These developments position glass-core substrates as an important technology direction for next-generation AI chips, large-format Chiplet packaging and CPO optical interconnects.

At C-TOUCH & DISPLAY SHENZHEN 2026, a dedicated TGV Glass Substrate Advanced Packaging Zone will connect key manufacturing stages through a visualized production line, covering glass materials, laser modification and micro-via processing, cleaning and activation, seed-layer formation and via-wall metallization, copper filling and electroplating, planarization, RDL and defect inspection. The zone is designed to showcase the manufacturing pathway and production-oriented solutions from glass material to finished TGV substrate.

From October 27–29, visitors can meet technology suppliers, evaluate process capabilities and explore cooperation opportunities at Shenzhen World Exhibition & Convention Center (Bao'an), Hall 16. The event provides a platform for technology evaluation, equipment selection, process validation and project implementation.

Featured Exhibitors & Technologies

T-Robotics Co., Ltd. | Booth 16A77

Founded in 2004, T-Robotics is a Korean specialist in semiconductor, display and industrial vacuum transfer robot solutions, offering vacuum robots, vacuum transfer modules and autonomous mobile robots (AMRs). 

Its vacuum robots have been supplied to Samsung Display's 8.6-generation OLED lines, LG Display's large-size WOLED lines and BOE's high-generation OLED lines. For HBM and AI-chip advanced-packaging glass-substrate applications, its vacuum handling robots have completed Korean and Japanese patent work and entered technical discussions with Samsung Electronics and SK hynix advanced packaging teams. Featured products include 3.5-generation and 8.6-generation semiconductor glass-substrate transfer robots and semiconductor packaging equipment.

Shenzhen Teyan Semiconductor Equipment Co., Ltd. | Booth 16A77-C

Founded in 2017, Teyan Semiconductor focuses on R&D, manufacturing, sales and technical services for advanced-packaging equipment. 

Its Laser, Plasma and Sputter equipment series serve SiP, Fanout, Chiplet and TGV/2.5D packaging applications. The TSH continuous vacuum sputtering system features high film uniformity, high hole/sidewall coverage, strong adhesion and low process temperature, and supports substrates including ABF, EMC, PID, Si and SiO2. Its customized chamber design supports large-format, high-throughput processing.

NEXTZHEN Co., Ltd. | Booth 16B115

NEXTZHEN specializes in high-performance glass-substrate processing. 

Its HEBS proprietary technology supports high-performance edge polishing wheels designed to suppress micro-cracks and edge chipping while improving edge strength. The solution has been deployed in mass-production lines for 8.5-generation and above display glass substrates. The company also provides trace-free suction-cup protective sleeves designed to reduce suction marks, scratches and residues on glass surfaces and support precision transfer under cleanroom conditions.

Ginet Semi-conductor Materials (Suzhou) Co., Ltd. | Booth 16A77-T

Established in May 2025, Ginet Semi-conductor focuses on conductive copper pastes and thermally conductive silver pastes. Its portfolio includes copper paste, silver paste and silver-coated copper paste for display, glass-substrate and silicon-substrate packaging, with customized formulation development. 

The company reports products for quartz and ordinary glass, low-temperature processes up to 250°C, and high-vacuum printing environments. Its conductive pastes support minimum via filling diameters of 15 μm and aspect ratios up to 45:1. The company states that it introduced a TGV plugging copper paste in China in 2022 and achieved mass production in 2024.

Jiangsu Jinggong Semiconductor Equipment Co., Ltd. | Booth 16A21

Based in Qidong, Jiangsu, Jinggong develops and manufactures semiconductor equipment including automatic wafer chamfering, single-wafer cleaning, wafer scrubbing and thinning systems. 

Its MET-5600 and MET-5800 automatic wafer chamfering machines target high-precision grinding, low material loss and stable operation across multiple wafer materials. The HAG-8000 automatic wafer thinning machine uses an automated dual-spindle configuration and CCD-based non-contact wafer centering. The QX-6800 automatic single-wafer cleaning machine supports chemical cleaning for multiple wafer sizes and customized chamber configurations, while the QX-2000 wafer scrubbing machine combines PVA brush cleaning with two-fluid and chemical processes.

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Why It Matters for Industry Buyers

For semiconductor packaging, display glass, equipment, materials and process-technology buyers, the featured technologies cover multiple critical links in the TGV ecosystem—from automated vacuum handling and sputtering to glass edge processing, via metallization materials, wafer grinding and cleaning. The concentrated presentation of these technologies enables visitors to assess process capabilities, identify equipment and materials suppliers, and explore potential cooperation within a single sourcing environment.

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About C-TOUCH & DISPLAY SHENZHEN 2026

C-TOUCH & DISPLAY SHENZHEN 2026 will take place from October 27–29, 2026, at Shenzhen World Exhibition & Convention Center (Bao'an), Shenzhen, China. The event will feature a dedicated TGV Glass Substrate Advanced Packaging Zone and showcase technologies spanning display, touch, semiconductor, automotive electronics and related advanced manufacturing applications.