With the rapid development of AI computing power and advanced packaging, traditional substrates are constrained by performance limitations, and domestic TGV technology is urgently need of industrial verification. A TGV demonstration production line is set up at this exhibition to fully present the whole process including micro-hole machining, metallization, hole filling, electroplating and inspection. It showcases complete domestic TGV processes, facilitates upstream and downstream connections and verifies mass production feasibility. This helps break overseas technical barriers, empowers industrial upgrading of advanced packaging, CPO and Micro LED, and accelerates the application of new materials in the post-Moore era.

TGV, or Through-Glass Via technology, serves as a core fundamental technology for advanced packaging and high-speed interconnection, and acts as a critical carrier for next-generation high-frequency and high-speed chip packaging. This exhibition zone demonstrates the core process chain of TGV glass substrates, ranging from substrate processing to pattern fabrication.

Participating Enterprises：

Booth No.: 16A77 | Hall 16

Date: Oct 27–29, 2026

Venue: Shenzhen World Exhibition & Convention Center (Bao'an)

Contact us to network with the above exhibitors.

Mr. Sam Jia | sam.jia@rxglobal.com

In this zone, visitors can view eight key process steps: Laser Induction → Etching → CVD → PVD → Electroplating → CMP → Coating → Photolithography. First, laser induction creates modified regions inside the glass. Next, etching forms high-aspect-ratio vias on the glass. CVD (Chemical Vapor Deposition) and PVD (Physical Vapor Deposition) are then deployed to deposit the dielectric insulation layer and seed layer on the inner walls of vias. After that, electroplating is realized via metallization to build conductive paths. CMP (Chemical Mechanical Planarization) follows to flatten the substrate surface. Photoresist coating is then performed. Finally, photolithography defines fine circuit patterns.

This integrated process demonstrates the manufacturing principle of TGV glass substrates. Compared with traditional silicon through-vias, glass substrates feature low dielectric loss, superior flatness and lower cost. They hold enormous application potential in AI computing chips, optical modules, RF devices, advanced packaging and other fields.

You may stop at each process station for observation and in-depth discussions with relevant core process enterprises, to learn how TGV technology breaks the critical bottlenecks of high-speed chip interconnection. Please feel free to consult our on-site staff if you have any questions!

More details，please visit our website: https://www.quanchu.com.cn/en-gb.html