1. BOE: Achieving Full-Color Display via Pixel-Level Conversion
BOE’s new patent (CN120113372A) reveals a novel Micro LED backplane architecture using individual color conversion layers aligned with monochrome LEDs. This enables pixel-precise RGB color mixing, creating vivid full-color imaging with greater panel stability—ideal for high-resolution applications like AR, automotive, and fine-pitch commercial screens.
2. Shenzhen MTC Co., Ltd: Improved Epitaxial Structure for Efficiency
MTC’s patented multi-layer epitaxial Micro-LED wafer (CN119364943B) includes innovative strain-balancing and superlattice layers to enhance wavelength uniformity and boost light output. It’s a major step forward for large-scale, uniform wafer production.
3. Raysolve: Boosting Quantum Efficiency with Microstructure Layers
Raysolve’s Micro-LED chip patent (CN120112035A) features a roughened wavelength conversion layer that reduces internal reflection and increases photon transmission—significantly improving brightness and color saturation. This addresses one of the core challenges in Micro LED performance.
4. Sunshine Global Circuits: Low-Cost Integration with White Light Sources
Targeting cost-sensitive markets, Sunshine Global Circuits’ patent (CN117219718B) introduces a Micro LED board where white light sources and filtering layers generate colored emission, simplifying manufacturing and reducing packaging costs—suitable for smart signage, wearables, and entry-level AR displays.
5. Wuhan Jingwei Technology: Vertical Full-Color Pixel Stacking
To push pixel density, Jingwei’s vertical Micro LED structure (CN120091673A) stacks blue, green, and red LED epitaxial layers with through-hole electrodes. This design eliminates side-by-side RGB layouts, allowing ultra-high-resolution, vertically integrated pixels—a game-changer for micro-displays and near-eye devices.
6. Shenzhen Trileek: Precision Laser Mass Transfer
Shenzhen Trileek’s laser-based Micro-LED transfer method (CN119794581A) combines visual recognition + AI-assisted defect detection for high-speed, high-accuracy placement of tiny Micro-LEDs. It solves the efficiency bottlenecks in conventional mechanical transfer and boosts yield rates in mass production.
